Technical Papers and Presentations

Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Error Analysis in Estimating Temperature-Dependent Thermal Diffusivity and Kinetic Parameters using Heat Penetration Data

K.D. Dolan[1,2], A.R. Sommerlot[1], and D.K. Mishra[1]
[1]Department of Biosystems and Agricultural Engineering, Michigan State University, East Lansing, Michigan, USA
[2]Department of Food Science and Human Nutrition, Michigan State University, East Lansing, Michigan, USA

Growing consumer demand for nutraceuticals has stimulated interest by food companies to increase levels of these health-promoting compounds. Thermal processing of canned foods in a retort produces a unique problem: some of the nutraceuticals are highly sensitive to temperature, and require accurate parameter estimates to predict their fate during processing. Error in temperature measurement due ...

Quasi-TEM Analysis of Multiconductor Transmission Lines Embedded in Layered Dielectric Region

S.M. Musa[1], and M.N.O. Sadiku[1]
[1]Prairie View A&M University Networking Academy, Prairie View, Texas, USA

This paper presents the quasi-TEM two-dimensional (2D) approach for the analysis of multiconductor transmission lines interconnect in single and two-layered dielectric region using the finite element method (FEM). FEM is especially suitable and effective for the computation of electromagnetic fields in strongly inhomogeneous media. We illustrate that FEM is as suitable and effective as other ...

Viscous damping of a periodic perforated MEMS microstructure when the Reynolds’ equation cannot be applied: Numerical simulations

D. Homentcovschi[1], and R.N. Miles[1]
[1]Department of Mechanical Engineering, SUNY Binghamton, NY

This paper develops a computational model for determining the total damping coefficient for a unit cell of a MEMS microscale device containing a repetitive pattern of holes. The basic cell of the microstructure is approximated by an axi-symmetric domain and the velocity and pressure fields are determined from solutions of the Navier-Stokes equations using the finite element software package ...

Designing B-field Coils from the Inside-Out

C.B. Crawford[1], Y. Shin[1], and G. Porter[1]
[1]Department of Physics and Astronomy, University of Kentucky, Lexington, Kentucky, USA

Traditionally the design cycle for magnetic fields involves guessing at a reasonable conductor / magnetic material configuration, using FEA software to calculate the resulting field, modifying the configuration, and iterating to produce the desired field. Our method involved solving the classical Laplace equation on regions with imposed boundary conditions, which was implemented straightforwardly ...

The Effect of a Correlated Surface Roughness and Convection on Heat Conduction

A.F. Emery[1]
[1]Department of Mechanical Engineering, University of Washington, Seattle, Washington, USA

Heat conduction through a slab, 0 ≤ x ≤ W is one dimensional. However, if one of the edges, say x=0, is rough the conduction will be two dimensional. The two dimensionality varies with the correlation length with a maximum at a length approximately 10% of the slab width. The maximum percentage standard deviation of the flux is of the order of 3 time that of the roughness. Monte ...

Wall Effects in Convective Heat Transfer from a Sphere to Power Law Fluids in Tubes

D. Song[1], R. Gupta[1], and Chhabra[2]

[1]West Virginia University, Morgantown, West Virginia, USA
[2]Indian Institute of Technology, Kanpur, India

Heat transfer from a sphere having a uniform temperature and falling axially in a cylindrical tube filled with an incompressible power-law liquid is numerically investigated. The governing equations for simultaneous flow around a confined sphere and heat transfer to power-law fluids were solved numerically using COMSOL Multiphysics. It was found that the wall effects on the mean Nusselt number ...

An Efficient Finite Element Analysis on an RF Structure Used to Evaluate the Effect of Microwave Radiation on Uveal Melanoma Cells

A. Dulipovici[1], D. Roman[2], I. Stiharu[2], and V. Nerguizian[1]

[1]École de technologie supérieure, Montreal, Quebec, Canada
[2]Concordia University, Montreal, Quebec, Canada

The use of Microwave/RF energy on cancer cells is explored for tumor ablation using medium power level ranging between a few Watts to about 50 Watts. In this research, low power levels, less than 100 mWatt, are used to evaluate the effect of this energy on Uveal melanoma cells by proliferation tests. The COMSOL simulation of the RF structure used to evaluate the radiation energy on ...

Finite Element Modeling a Redox-Enzyme-Based Electrochemical Biosensor

Y. Huang[1], and A. Mason[1]
[1]Electrical and Computer Engineering, Michigan State University, East Lansing, Michigan, USA

This paper describes the modeling of an electrochemical biosensor embedded in a microfluidic channel to determine the concentration of a target biomolecule. The total amount of analyte in the sample can be calculated by integrating the analyte concentration over the duration of the peak current. The biosensor is constructed by immobilizing redox-enzyme on an interdigitated array (IDA) electrode ...

COMSOL Derived Universal Scaling Model For Low Reynolds Number Viscous Flow Through Microfabricated Pillars – Applications to Heat Pipe Technology

N. Srivastava[1], and C.D. Meinhart[1]
[1]Department of Mechanical Engineering, University of California Santa Barbara, Santa Barbara California, USA

Cooling of high-power density electronic devices remains a challenge. Microfluidic heat-pipes with the potential of achieving ultra-high thermal conductivities offer a low-cost technology for cooling electronics. To achieve high thermal conductivity, it is critical to maximize the rate of liquid transport inside the heat pipe. We propose a novel array of microfabricated pillars to maximize liquid ...

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